Where as most dells inspiron 6000 consume 11 watts at idle, the t43 takes 14. On a 6 cell battery, that's 30% more power consumption while having the same usage and same screen brightness. Also, dells are cooler and heat is distributed more evenly unlike the hot southbridge and gpu of thinkpads.
On my thinkpad the entire cooling system is composed of one sheet of copper, some welted fins, copper spacer attachments, and three copper tubes that seem like heatpipes.

Two of the heatpipes are for the CPU and one longer one is for the GPU. The northbridge die is exposed with no heatsinks. The southbridge rests below the wireless card and is also bare with no heatsink. I have no yet lifted out the 56K daughter board to check if the power mosfets which are probably also bare.
Notes of the Cooling System
If you take off the cooling array/heatsink, you notice that the CPU has a gray compound on it which I cannot identify. Some others have a white compound. If you run Prime95, you notice that the heatpipes gets hot and conducts adequately along the length of the heatpipe. This is very good for a laptop so thin.
The GPU has one heatpipe above the copper plate. If you run a 3D graphics demo to heat up the GPU, the GPU gets extremely hot but the heatpipe is only warm at near the fan. This indicates that it is not conducting very well. Beneath the heatsink, there is a thermal compound and then a thermal pad and then the GPU casing and the the GPU die. This is a very inefficent setup to begin with along with the ineffective heatpipe. When I run 3D Mark and then check TP4xfancontrol, the GPU is by far the hottest thing at 66 while the CPU maxes out at 57-58.
Now to the fan. The fan is attached to the cooling system and looking at the blades, it tries to be a blower style fan since the blades are at a right angle to the axis of spin. The thing with that is, blowers work by taking air from the top and bottom of the fan and spitting it out the side. However, the t43 base is immediately below the fan and the keyboard rests directly above it. Therefore, no air gets on either top or bottom of the blower. If you take a look at dells, there are air inlets on the bottom and air comes out the back. Instead, thinkpad's cool by just having the fan suck in air the same place as it goes out. This is not only inefficient, it wastes power since air currents are at conflict.
As for the fins, they are short and they are welted. Iwould have expected IBM to use skived fin process. Welting is fast and cheap but conduction significantly lower. The stacking of copper is also odd instead of making it from a solid block.
A shortcoming of many notebooks is that they don't provide diode temperatures and simply provide the socket temperatures.
That's about it, I'll add more if I think of more.[/img]




