I added copper mass to T61's HSF with copper plates(thickness 1mm) and copper tape(0.1mm).
Should I insert insulation tape on the top of the HSF so it won't touch the keyboard's bottom ? Is the touching a problem flow of electricity ?
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Electricity? Probably not.
IMO the bigger problem is heat transfer, as the keyboard wasn't designed to carry heat.
I'm not sure, but the heat might degrade (over time) the plastic sheets that make up the keyboard's circuit board.
Add insulation tape? Better safe than sorry.
Backup: X220 4291-P79 i5-2520M
Toy: X60F Core Solo U1300
In pieces: two retired but working X61Ts
RIP: 760XD 9546-U9E; X61 7676-A24; and a BOE-Hydis HV121P01-100 in failed SXGA+ mod
- 1pc D4mm, L=80mm shaped copper rod
- 2pcs copper plates\rounds (Thickness 1-2mm)
- Copper tape
On top of CPU and GPU heat sinks and final added thickness ranging from +1.5-2.5mm and no worries everything fits perfectly. Paste is Noctua NT-H1 and thermal pad is Arctic 1.0mm.
CPU: T9300 processor temp= 30-42*C
GPU: Geforce 140NVS temp= 60-80*C (0817A2=17 week 2008)
Previously had T8300 and I think values are -7*C lower
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