I was curious about the underlying hardware differences, which I haven't seen much about in previous posts, so I looked through the T61/R61 Hardware Maintenance Manual (HMM) for common/different components.
The listing/links for all HMMs is at http://www-307.ibm.com/pc/support/site. ... 39298.html
The following are all the items I found that are not shared in common between the 14.1" widescreen versions of the T61 and R61, as per the HMM:
Code: Select all
Specifications (pps. 34-36)
Ultrabay Slim device (for DVD drive, 9.5 mm high
T61 notebooks) DVD/CD-RW combo drive, 9.5 mm high
DVD-RAM/RW drive, 9.5 mm high
Ultrabay Enhanced device DVD drive, 12.7 mm high
(for R61 notebooks) DVD/CD-RW combo drive, 12.7 mm high
DVD-RAM/RW drive, 12.7 mm high
I/O ports:
IEEE 1394 connector (for T61 notebooks)
Battery:
Ultrabay Slim Li Polymer battery (3 cells) (for T61)
Parts list (pps. 114-168):
Magnesium structure frame for T61
Magnesium structure frame for R61
System board assembly, Intel GMA X3100 GM965 without 1394 for R61
System board assembly, Intel GMA X3100 GM965 with 1394 for T61
System board assembly, Intel GMA X3100 GM965 with 1394 for R61
System board assembly, nVIDIA Quadro NVS 140M for T61
System board assembly, nVIDIA Quadro NVS 140M for R61
Thermal device and fan (Integrated) UBS for T61
Thermal device and fan (Discrete) UBS for T61
Thermal device and fan (Integrated) UBE for R61
Thermal device and fan (Discrete) UBE for R61
For WXGA LCD:
Clear plate kit (T61)
Clear plate kit (R61)
For WXGA+ LCD:
Clear plate kit (T61)
Clear plate kit (R61)
The IEEE 1394 connector implied for T61 only is an obvious error, given that custom R61s all come with IEEE 1394.
Is the IEEE 1394-less R61 system board for an R61e?
Why are the clear plate kits different when the LCDs are the same?
Why no R61 Ultrabay battery option?
The fundamental difference is that the R61 chassis is exactly 3mm thicker than the T61 chassis (and can get a BluRay drive slipped in sooner?) for an overall thickness F/R (minus feet) of 1.20"/1.37" rather than 1.09"/1.26".
As per the spec & parts list, that translates to a different chassis cage, 12.7mm vs. 9.5mm optical drives, different system boards (interesting question for Lenovo engineering as to why they paid for two different designs) and different cooling systems for the different system boards.
Otherwise, the keyboards are the same, the LCDs are the same, the components other than optical drives are the same, the component upgrade options are all the same, and the specifications - except as noted above - are the same. Basically, going by the HMM listing, they are the same machine, differing only in the chassis thickness, and the label that is put on at the end.
Lenovo's overall T vs. R differentiation strategy does become clearer, looking ahead to the T61-only "p" versions with the FX 570M in both 14.1" std and 15.4W, and the R61-only 15" std (integrated graphics, only).
Still, unless there are other factors that don't appear in the HMM or spec sheets, both the T61 and R61 14.1W models seem to be equally "top of the line".
Can anyone who has more detailed knowledge of ThinkPad internals (in either sense) confirm this initial indication that the T and R series, going forward, will differ only in their feature sets, and not in terms of the quality of components or construction?






