Thinkpads Forum

I have the HMM. I bought a X1400 motherboard and 1400x1050 LCD to replace my 950GMA and 1024x768 one. The new motherboard came complete with the base minus the keyboard, hard drive, WLAN, WWAN, keyboard and top bezel/palm rest.

Can I just follow the HMM instructions to replace the bottom bezel only? It looks like that's all I am going to need to do and then just transfer my other cards, plastics, etc off my current laptop.

I ordered a new screwkit. Should the foam around the heatsink be replaced? I don't see a reference to it in the HMM. It looks fine.

Also is there a way to determine if I have a rev 3 motherboard by physical inspection. It has a born on date of 6/2008 (2007-63U). My current laptop is a 2006 (1953-D9U) model and has the rev 3.

I have a Atheros Wireless N, the extra antenna, a new SXGA screen, a T7200 and bluetooth to install.

I am somewhat over my head here, but the foam around the heatsink is most likely the thermal pad. There might be two, one for the cpu and the gpu. You should definitely replace those.

As for the revision of the board, is there any particular reason that this matters? It is newer, so maybe they ironed out a few bugs along the way. Other than that, I think you should be set, just transfer anything over as long as it looks right. If it doesn't look right, something is probably wrong.

If you have any questions I will try to answer them, but someone with a more complex knowledge of an actual t60 motherboard would be more suited to help you.

I got it straightened out.

The foam I mentioned was the 1/16" open cell stuff above and around the intake and exhaust fins that seal it against the laptop body.

Once I got it apart it all looked good. It was a darker foam than the one in my previous T60.

One thing I didn't like is the new heatsink had an etched area for the core duo chip which doesn't match the C2D one. My temps are what others were getting though, so I guess it's cooling fine.

I am not happy about the GPU temps though and how the heatsink works for it. I may make up a pure copper insert for it and get rid of the thermal pads.

Revision is important for the C2D chips. Earlier boards could not support them. I was ok, the new motherboard even had the latest BIOS installed.

Everything went together good. Some things that didn't match the HMM were the M2x2.8 vs 3.0mm screws...my IBM original screwkits only had one size and they seemed to work just fine in all the positions either were called for.

Thanks

You can try to carefully adjust the part of the heatsink that sits over the GPU.
It may not make full/proper contact with the GPU, so a little bending might improve things.
Careful, you only need a fraction of 1/10 of an inch or less!

Glad you got it straightened out, but like I said, in way over my head!