I wasn't worried about long-term damage, since the laptop is rarely used nowadays, but at some point I decided to take action. I assumed the fan and air ducts may be clogged (cat hair and dust), and also maybe the thermal compound could be replaced. The stock thermal compound used on IBM fan assemblies is not generally held in high esteem.
In these laptops it's really easy to reach the fan assembly - 1 screw to remove the hard drive, 4 screws to remove the keyboard and the fan is exposed for cleaning. 5 more screws are needed to remove the assembly - without messing with any structure components (like bezel or frame).
The fan was dusty, but far less than I expected. It also did not appear that the air paths have been clogged. However the white thermal compound on the heatsink and CPU seemed in bad shape - very little of it and what's there - quite dry.
So I cleaned it and applied a small amount of the dark gray Shin-Etsu thermal paste (either this one or one quite similar). It is considered to be quite good.
The results are very satisfying - about 10C-15C reduction of temperature across the board. The CPU now idles at 45-50C, rising to 55C under light load, and typically stays in high 60s or low 70s under full load.
So it appears to be another story of what a good thermal paste can do and another sad evidence of the quality of the stock paste used on IBM fan assemblies. I don't typically subscribe to the notion that thermal paste must be refreshed regularly. My experience has shown that good paste retains its conductivity and "performance" even after several years. But I guess paste that is "not so good" does not.
Just thought to share this little successful maintenance story in case someone else experiences similar heating issues with their X3x.





