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Workaround for cracking noise, with left side of top-case

Posted: Sun Aug 12, 2007 2:55 am
by 45
Hi,

I was very annoyed by the cracking noise, wich was produced, when I lift the notebook, holding it there where the Cardbus-Slot sits. Apart from the top case of the keyboard, the X60 is built very sturdy, so I can't understand, why this importand surface Is built in such a poor quality. The plastik is way to thin to give the neccessary stability.

The solution for me was simply to put in an old 32mb memory-card into the pcmcia-slot, wich prevents to much bending of the plastic. Now, regardless where I hold the X60 to lift it, there is no noise anymore.

Posted: Sun Aug 12, 2007 3:11 am
by The Spirit of X21
Unfortunately, to get the X60 to its current weight, certain tradeoffs happen in the design process. Thin plastics are a part of that, though the magnesium alloy frame is quite strong. Lenovo could have used thicker plastics, but then it would have added to the weight. Everything's a compromise.

Posted: Sun Aug 12, 2007 8:46 am
by 45
The Spirit of X21 wrote:Unfortunately, to get the X60 to its current weight, certain tradeoffs happen in the design process. Thin plastics are a part of that, though the magnesium alloy frame is quite strong. Lenovo could have used thicker plastics, but then it would have added to the weight. Everything's a compromise.
I can't believe, a somewhat thicker plastik would add so much weight. Also there are very good carbon-plastik combinations, wich would not bend so much with the same thickness. I have a sony vaio wich is made of carbon-plastic and I have the impression it is nearly as sturdy as magnesium and somewhat lighter.

Fortunately the bending manifests only above the pcmcia-slot and with an inserted card the problem is solved, like mentioned above.