T410 - reapply thermal paste - noticeable improvement
Posted: Tue Jun 14, 2016 12:23 pm
As some of you may remember, a couple of years ago, applying Shin-Etsu MicroSi to my X32 gave me a significant temperature reduction. Our IT folks use this brand for most of their setups, and they probably have good reasons to trust it.
Recently I noticed that my work T410 runs very hot under load. While compiling a big project in Visual Studio, the temperatures were sometimes exceeding 90C when undocked, and were creeping towards 100C when docked with the lid closed (which is the normal mode of operating for me).
The first thing I tried was to clean the fan and the vents, but it had almost zero effect (they were not so dusty to begin with). So I decided to try reapply the thermal paste to the heat sink.
Results were quite satisfactory. Even though the paste that was already there looked very similar (according to some sources, Lenovo does use Shin-Etsu), and was not even so dry, it seemed not well-spread. A lot was caught in the gaps surrounding the die, and what was on the die seemed a bit uneven.
The rule of thumb I was taught is not to bother with spreading. Instead you use a small amount in the center of the die (somewhere between rice grain and pea in size, depending on the size of the die) and let the heatsink squash it. So far it's been working well for me. It worked well this time as well. Now full load temperatures usually stay in upper 70s to lower 80s, and even when docked, closed at 100% load for over half an hour, the temps only barely reached 90C. So about a 10C reduction in temperatures across the board was achieved by refreshing the thermal paste.
Now, I am not really a believer in the theory that thermal paste must be refreshed/replaced, but it's the second laptop where I've done it to noticeable improvement. I think that if a good paste is used, and if it's applied correctly, it is normally not mandatory (I haven't had to replace it on any of the machines I built myself), but in case of a doubt - go for it.
The access to the fan assembly is a bit harder on the T410 than on most Thinkpads I had to work with. Usually I just had to remove the keyboard, palmrest and keyboard bezel to get full access. On the X32 even the bezel removal is unnecessary. The T410 also requires you to remove the speakers and the LCD unit to be able to fully remove the fan assembly. Since I did not actually need to replace it, I was able to cheat a bit, and did not remove the fan assembly (which spared me the need to remove the LCD). Instead I just propped it up just enough to clean the old paste, and apply the new one. It also helped that this an integrated GPU model, and so there is only a single die to cover.
Heh, at least it's not as bad as the X220 which has the fan on the underside of the system board and you have to disassemble the whole thing.
Recently I noticed that my work T410 runs very hot under load. While compiling a big project in Visual Studio, the temperatures were sometimes exceeding 90C when undocked, and were creeping towards 100C when docked with the lid closed (which is the normal mode of operating for me).
The first thing I tried was to clean the fan and the vents, but it had almost zero effect (they were not so dusty to begin with). So I decided to try reapply the thermal paste to the heat sink.
Results were quite satisfactory. Even though the paste that was already there looked very similar (according to some sources, Lenovo does use Shin-Etsu), and was not even so dry, it seemed not well-spread. A lot was caught in the gaps surrounding the die, and what was on the die seemed a bit uneven.
The rule of thumb I was taught is not to bother with spreading. Instead you use a small amount in the center of the die (somewhere between rice grain and pea in size, depending on the size of the die) and let the heatsink squash it. So far it's been working well for me. It worked well this time as well. Now full load temperatures usually stay in upper 70s to lower 80s, and even when docked, closed at 100% load for over half an hour, the temps only barely reached 90C. So about a 10C reduction in temperatures across the board was achieved by refreshing the thermal paste.
Now, I am not really a believer in the theory that thermal paste must be refreshed/replaced, but it's the second laptop where I've done it to noticeable improvement. I think that if a good paste is used, and if it's applied correctly, it is normally not mandatory (I haven't had to replace it on any of the machines I built myself), but in case of a doubt - go for it.
The access to the fan assembly is a bit harder on the T410 than on most Thinkpads I had to work with. Usually I just had to remove the keyboard, palmrest and keyboard bezel to get full access. On the X32 even the bezel removal is unnecessary. The T410 also requires you to remove the speakers and the LCD unit to be able to fully remove the fan assembly. Since I did not actually need to replace it, I was able to cheat a bit, and did not remove the fan assembly (which spared me the need to remove the LCD). Instead I just propped it up just enough to clean the old paste, and apply the new one. It also helped that this an integrated GPU model, and so there is only a single die to cover.
Heh, at least it's not as bad as the X220 which has the fan on the underside of the system board and you have to disassemble the whole thing.