Upgraded processor in A31 -- two questions

R, A, G and Z series specific matters only
Post Reply
Message
Author
tbessie
Sophomore Member
Posts: 207
Joined: Tue May 25, 2004 3:00 am

Upgraded processor in A31 -- two questions

#1 Post by tbessie » Sun Sep 19, 2004 9:56 pm

Hey all...

So I upgraded the processor in my A31, and now have 2 questions:

1) I noticed there was some goo between the fan/heatsink assembly and the processor. I suppose this is something to create a firm thermal connection between the processor and the heatsink. There wasn't much of it available, but I smeared some back from the sides of the new processor on to the top before reassembling the computer. Am I in grave danger of frying my processor if I don't go out and buy more of this goo and make sure there's a bunch of the stuff on the chip (ie. if a firm seal was not achieved with what I had)? And what kind of goo should I get? And, will my thinkpad alert me of processor overheating?

2) When I first started my machine after putting it back together, it didn't seem to want to boot. So I stopped it and started it a couple of times, and finally let it do it's thing, and THEN it booted. I suppose the BIOS was putting together a list of bootable devices or something like that. Did I do any damage to the BIOS's state by interrupting it before it had completed this task, even though I finally did let it complete it?

Arcane stuff, all this, but perhaps someone out there knows what to do. Thanks!

- Tim

dperron
Posts: 43
Joined: Wed May 19, 2004 1:37 pm
Location: Quebec city, Canada

#2 Post by dperron » Mon Sep 20, 2004 2:54 pm

1)There are many opinions on this... however most agree that you should only apply a very thin (paper thin) layer of thermal compound on the whole interface (the area where the cpu and heatsink touch each other) using a credit card or a rasor blade. The concept is that the thermal compound will fill every microscopic (invisible) crack on the cpu and heatsink. So basically you should only apply enough to see a slight haze (i know.. i also "feel" like i should put more...).

It's hard to say if you have enough, are you able to spread it over the whole heat sink interface?

The best thermal compound that i know of is called "Artic Silver 5" but i've never found any at my local computer store...(never bought any either...)

2) I don't think so, but i heard this is a good way of corrupting your EEPROM memory (which isn't the case since your TP actually booted correctly.

tbessie
Sophomore Member
Posts: 207
Joined: Tue May 25, 2004 3:00 am

So what's it actually doing when it delays boot?

#3 Post by tbessie » Mon Sep 20, 2004 5:31 pm

Does anyone know why it's delayed in booting after disconnecting the internal battery and switching processors (and reconnecting the internal battery, of course)? What's it actually doing at that point?

- Tim

dperron
Posts: 43
Joined: Wed May 19, 2004 1:37 pm
Location: Quebec city, Canada

#4 Post by dperron » Tue Sep 21, 2004 8:08 am

Does it only happen when you unplug the battery?
or everytime afterward?

if it happens only once, that's cause the computer falls back on its feet... (scanning for device, selftest, etc...)

However if this happens everytime, this is problematic...

tbessie
Sophomore Member
Posts: 207
Joined: Tue May 25, 2004 3:00 am

It only happens once

#5 Post by tbessie » Tue Sep 21, 2004 3:25 pm

But I wonder what, specifically, the BIOS is doing at this point. I called IBM, and the guy I spoke with didn't know, and since my support time is over, he couldn't bump it up to 2nd or 3rd level support. [censored].

- Tim

Post Reply
  • Similar Topics
    Replies
    Views
    Last post

Return to “ThinkPad R, A, G and Z Series”

Who is online

Users browsing this forum: No registered users and 6 guests