Replaced thermal compound?

[control]

I was just wondering if anybody's opened up their x100e and put new thermal paste on it, maybe some arctic silver?
I'd love to see how much difference it would make.

[hmmwv]

I was looking at page 96 of the maintenance manual, it mentioned "thermal rubber" which implies a thick thermal pad between the chip and the heatsink. I think this is the bottleneck in heat transfer, apply a good thermal paste on the thermal pad may not be much help. After all, we can't replace the entire thermal pad with AS, it's too thick to be replaced entirely.
This is just my guesstimation right now, I haven't had the chance to disassemble the system board to take a closer look at the design.

[The Solutor]

I was just wondering if anybody's opened up their x100e and put new thermal paste on it, maybe some arctic silver?
I'd love to see how much difference it would make.

I think that replacing the thermal pad on the x100 is simply pointless. The thermal compound makes sense on a desktop pc or on a poorly built notebook, where you have a hot cpu and a relatively fresh heatsink, because the poor thermal transfer rate between the two.

And is not the X100 case, definitely

When the X100's cpu is fully loaded you have a pretty hot air flow out of the vent, just because the heat is well transferred from the cpu to the heatsink and from the heatsink to the air.

If you want lower temperatures in the x100 you have to increase the air flow and/or increase the heatsink surface, and both aren't viable options, due to the mechanical constraints.