It's been found on many many laptops, including Thinkpad T4x series that the graphics and southbridge chips become unsoldered after a period of time.
These chips are soldered to the motherboard by 100's of tiny solder balls which are collectively called the Ball Grid Array or BGA.
There are a variety of reasons for this happening such as picking up the laptop in such a way that the motherboard inside flexes and breaks some of the chip solder ball joints.
Also it's been found that the normal switching on and off of the laptop causes the BGA temperature to change, stressing the solder joints and causing eventual failure.
What's needed is a method of resoldering these tiny solder balls back onto the motherboard again, and the most reliable method is to use Infrared reflowing.
This uses a combination of infrared head which is applied in the correct amounts on both the top and bottom of the motherboard and over the chip which gently reheats the BGA and causes it to melt and resolder the chip back onto the motherboard again. This is called reflowing (or resoldering).
In many cases this is a good long-term fix.
However sometimes the BGA is so damaged that the only thing left is to remove the chip, replace the solder balls and to resolder the chip back onto the motherboard again. This is called chip reballing and is the best sort of repair because the solder balls are renewed and good solder joints created.
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