I am a bit curious what was the reason for failing VRAMs on those FireGL (v5200 & v5250) boards.
From my coppershim experience on x1300 and x1400 it seems RAMs on those require no cooling whatsoever (otherwise they would have failed long ago after I removed thermopads switching to coppershims).
Perhaps the story is different for VRAMs used for FireGL configs? Do they require cooling via thermopad or they don't? Because if they don't - was the reason for their failures overheating and/or high amplitudes of temperature they were exposed to due to thermopad placement? I have seen on ebay and other auction sites quite a lot of FireGL boards restored to working condition via unsoldering one or more VRAM modules, which means what was failing wasn't bga below chip or solders under memory chips but rather - most probably the chips themselves (otherwise they'd be resoldered/reflowed rather than removed).
So once again - to put thermopad on VRAMs or not to put - that's the (Hamlet's) question.
High-pitched fan noise [viewtopic.php?f=29&t=86763]?
- Sure the fan [viewtopic.php?f=29&t=74322]?
- Fan lubrication [viewtopic.php?f=29&t=87448],
- Fan replacement/reapplying thermal grease [viewtopic.php?f=29&t=80203].
X61 7673-V2V, T60 2007-QPG, T42 2373-F7G, X32 (IPS Screen), A31p w/ Ultrabay Numpad, A21m 2628-GXU
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